Cheng, X. ., Yang, H. ., Jakubisin, D. J., Tripathi, N. ., Anderson, G. ., Wang, A. K., … Reed, J. H. (2022). 5G Physical Layer Resiliency Enhancements with NB-IoT Use Case Study. In MILCOM 2022 - 2022 IEEE Military Communications Conference (MILCOM) (pp. 379–384).
First name
J.
Middle name
H.
Last name
Reed